A new approach to evaluate the elastic modulus of metallic foils

by C.O.W. Trost, S. Wurster, C. Freitag, A. Steinberger, M.J. Cordill
Published 2020-11-01

Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

by A. Lassnig, B. Putz, S. Hirn, D.M. Többens, C. Mitterer, M.J. Cordill
Published 2021-02-01

Electrically reversible cracks in an intermetallic film controlled by an electric field

by Z. Q. Liu, J. H. Liu, M. D. Biegalski, J.-M. Hu, S. L. Shang, Y. Ji, J. M. Wang, S. L. Hsu, A. T. Wong, M. J. Cordill, B. Gludovatz, C. Marker, H. Yan, Z. X. Feng, L. You, M. W. Lin, T. Z. Ward, Z. K. Liu, C. B. Jiang, L. Q. Chen, R. O. Ritchie, H. M. Christen, R. Ramesh
Published 2018-01-01