A high performance differential amplifier through the direct monolithic integration of InP HBTs and Si CMOS on silicon substrates

by Bulsara, Mayank, Fitzgerald, Eugene A., LaRoche, J. R., Kazior, T. E., Lubyshev, D., Fastenau, J. M., Liu, W. K., Urteaga, M., Ha, W., Bergman, J., Choe, M. J., Smith, D., Clark, D., Thompson, R., Drazek, C., Daval, N., Benaissa, L., Augendre, E.
Published 2010

Progress and challenges in the direct monolithic integration of III-V devices and Si CMOS on silicon substrates

by Fitzgerald, Eugene A., Bulsara, Mayank, Augendre, E., Benaissa, L., Daval, N., Drazek, C., Thompson, R., Clark, D., Smith, D., Choe, M. J., Bergman, J., Ha, W., Urteaga, M., Liu, W. K., Fastenau, J. M., Lubyshev, D., LaRoche, J. R., Kazior, T. E.
Published 2010

Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration

by Bulsara, Mayank, Fitzgerald, Eugene A., Yang, N., Liu, W. K., Lubyshev, D., Fastenau, J. M., Wu, Y., Urteaga, M., Ha, W., Bergman, J., Brar, B., Drazek, C., Daval, N., Benaissa, L., Augendre, E., Hoke, William E., LaRoche, J. R., Herrick, K. J., Kazior, T. E.
Published 2012

High Performance Mixed Signal Circuits Enabled by the Direct Monolithic Heterogeneous Integration of InP HBT and Si CMOS on a Silicon Substrate

by Kazior, T. E., LaRoche, J. R., Urteaga, M., Bergman, J., Choe, M. J., Lee, K. J., Seong, T., Seo, M., Yen, A., Lubyshev, D., Fastenau, J. M., Liu, W. K., Smith, D., Clark, D., Thompson, R., Bulsara, Mayank, Fitzgerald, Eugene A., Drazek, C., Guiot, E.
Published 2013