Multiscale Microstructures and Microstructural Effects on the Reliability of Microbumps in Three-Dimensional Integration

by Paul Conway, Frank Altmann, Zhiyong Wu, Hua Xiong, Zhiheng Huang
Published 2013-10-01

Challenges and Perspectives for Vertical GaN-on-Si Trench MOS Reliability: From Leakage Current Analysis to Gate Stack Optimization

by Kalparupa Mukherjee, Carlo De Santi, Matteo Borga, Karen Geens, Shuzhen You, Benoit Bakeroot, Stefaan Decoutere, Patrick Diehle, Susanne Hübner, Frank Altmann, Matteo Buffolo, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini
Published 2021-04-01