Development of a numerical model for simulating stress corrosion cracking in spent nuclear fuel canisters

by Xin Wu, Fengwen Mu
Published 2021-05-01

Graphene and Graphene-Based Nanomaterials for DNA Detection: A Review

by Xin Wu, Fengwen Mu, Yinghui Wang, Haiyan Zhao
Published 2018-08-01

Low temperature Cu bonding with large tolerance of surface oxidation

by Hui Ren, Fengwen Mu, Seongbin Shin, Lei Liu, Guisheng Zou, Tadatomo Suga
Published 2019-05-01

Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag₂O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

by Liangliang He, Junlong Li, Xin Wu, Fengwen Mu, Yinghui Wang, Yangting Lu, Tadatomo Suga
Published 2020-02-01

Author Correction: Development of a numerical model for simulating stress corrosion cracking in spent nuclear fuel canisters

by Xin Wu, Fengwen Mu, Scott Gordon, David Olson, Stephen Liu, Zeev Shayer, Zhenzhen Yu
Published 2021-10-01

Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor

by Fengwen Mu, Yang Xu, Seongbin Shin, Yinghui Wang, Hengyu Xu, Haiping Shang, Yechao Sun, Lei Yue, Tatsurou Tsuyuki, Tadatomo Suga, Weibing Wang, Dapeng Chen
Published 2019-09-01

Wafer-scale heterogeneous integration InP on trenched Si with a bubble-free interface

by Jiajie Lin, Tiangui You, Tingting Jin, Hao Liang, Wenjian Wan, Hao Huang, Min Zhou, Fengwen Mu, Youquan Yan, Kai Huang, Xiaomeng Zhao, Jiaxiang Zhang, Shumin Wang, Peng Gao, Xin Ou
Published 2020-05-01