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181by Yang, Guang“.... This thesis reports such a silicon integrated-circuit (IC) prototype of the OZGF-with-LI system fabricated...”
Published 2012
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182by Chia, Mark P. C.“...The IC industry is developing at a phenomenal rate where smaller and denser chips are being...”
Published 2002
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183“...碩士 === 國立中央大學 === 企業管理研究所 === 93 === This paper gives a logistics solution for the global IC...”
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184by Florian Kolbl, Yannick Bornat, Jonathan Castelli, Louis Regnacq, Gilles N’Kaoua, Sylvie Renaud, Noëlle Lewis“... efficacy or energy efficiency. The designed system comprises a High Voltage CMOS ASIC generating a...”
Published 2021-08-01
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185“... and the fabricated CMOS circuits are suitable for further integration with SERDES, CDR, and CODEC ICs for wire-line...”
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186by Gaston, Godfrey Jonathan“... have also been fabricated using the same experimental design as for the RSM simulation analysis...”
Published 1992
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187“..., and simplicity. But the traditional wireless systems are built from mixture of IC technologies: GaAs or Silicon...”
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188“.... Therefore, we design a portable self balance- enhanceing device with low power consumption and it has widely...”
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189“... amplifier (PGA). They are fabricated in TSMC 0.35μm CMOS 2P4M process. The first stage of the system...”
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190by Sesler, Josh J.“..., for designing effective silencers for small IC engines. The solution must be lightweight, compact, conformable...”
Published 2014
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191“...A biopotential acquisition analog front-end (AFE) integrated circuit (IC) is presented...”
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193“...碩士 === 元智大學 === 通訊工程學系 === 93 === This thesis presents the designs and fabrications of the multiple...”
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194“...碩士 === 元智大學 === 通訊工程學系 === 93 === This thesis presents the designs and fabrications of the multiple...”
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197“...-functional design. However, the most front-end process of designing and manufacturing the wafer...”
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198“...碩士 === 國立交通大學 === 管理學院科技管理學程 === 100 === The integrated chain of IC (integrated circuit) design...”
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199“... to monitor the fabrication and improve the quality. They also can be the reference on improving the design...”
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200“... regulator. Our design considers the parasitic effects of various IC packages. To suffice the SoC target...”
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