Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

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In this study, the effect of 0.07 wt.% graphene nanosheets (GNSs) on the thermal, microstructure and intermetallic compounds (IMC) growth kinetics were investigated. Experimental results showed that addition of GNSs to the Sn-3.5Ag solder alloy slightly increased the melting temperature. Scanning el...

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Bibliographic Details
Main Authors: IOP, Mayappan, R (Author), Salleh, A (Author)
Format: Article
Language:English
Published: 2017
Subjects:
BI
COMPOUND
CU
NANOSHEETS
SN
STRENGTH
Online Access:View Fulltext in Publisher
Description
Summary:In this study, the effect of 0.07 wt.% graphene nanosheets (GNSs) on the thermal, microstructure and intermetallic compounds (IMC) growth kinetics were investigated. Experimental results showed that addition of GNSs to the Sn-3.5Ag solder alloy slightly increased the melting temperature. Scanning electron microscope (SEM) micrograph revealed that with the addition of GNSs has transformed the morphologies of the interfacial IMC from scalloped to more planar-shaped after isothermal aging for 500 hours. Growth kinetics calculations show that the k value was reduced from 9.08 x 10(-14) cm(2)/s to 5.73 x 10(-14) cm(2)/s with the addition of graphene. Thereby, it indicates that the addition of GNSs suppressed the growth of the IMC layers hence retarded the IMC's growth.
DOI:10.1088/1757-899X/205/1/012017

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