Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder
In this study, the effect of 0.07 wt.% graphene nanosheets (GNSs) on the thermal, microstructure and intermetallic compounds (IMC) growth kinetics were investigated. Experimental results showed that addition of GNSs to the Sn-3.5Ag solder alloy slightly increased the melting temperature. Scanning el...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2017
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| Subjects: | |
| Online Access: | View Fulltext in Publisher |