The Effect of Ni addition in SnAgCu Solder on Microhardness and Intermetallic Formation
This research was carried out to improve the properties of the Sn-3.5Ag-1.0Cu (SAC) solder in terms of reaction with the copper substrate by adding Ni into the solder. The SAC-Ni composite solders were synthesized using powder metallurgy route. Microhardness test values show the optimum mixing time...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2018
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| Subjects: | |
| Online Access: | View Fulltext in Publisher |