Intermetallic and Tensile Study of the Newly Developed Sn-2.0Ag-0.7Cu Solder with Addition of 0.5 wt.% Zinc
Sn-Pb solder is well known as an excellent solder in electronic packing. However, the Pb usage was eliminated in electronic assemblies due to its toxicity which can damage the kidneys, liver, and blood. Due to this problem, lead-free solders were proposed in order to replace lead-based solders. Sn-A...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2018
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| Subjects: | |
| Online Access: | View Fulltext in Publisher |