Electrodeposition of copper in the presence of an acoustically excited gas bubble
Copper has been electrodeposited in the presence of an acoustically excited gas bubble (Ar bubbles with radii 1.5 mm held below a copper plate). Under the conditions employed, an acoustic pressure amplitude of 69.5 Pa is sufficient to excite multiple surface wave modes on the bubble wall. This is ob...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
2007-05.
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Subjects: | |
Online Access: | Get fulltext |