Electrodeposition of copper in the presence of an acoustically excited gas bubble

Copper has been electrodeposited in the presence of an acoustically excited gas bubble (Ar bubbles with radii 1.5 mm held below a copper plate). Under the conditions employed, an acoustic pressure amplitude of 69.5 Pa is sufficient to excite multiple surface wave modes on the bubble wall. This is ob...

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Bibliographic Details
Main Authors: Offin, Douglas G. (Author), Birkin, Peter R. (Author), Leighton, Timothy G. (Author)
Format: Article
Language:English
Published: 2007-05.
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