A dicing free SOI process for MEMS devices
This paper presents a full wafer, dicing free, dry release process for MEMS silicon-on-insulator (SOI) sensors and actuators. The developed process is particularly useful for inertial sensors that benefit from a large proof mass, for example accelerometers and gyroscopes. It involves consecutive fro...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2012-07.
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| Subjects: | |
| Online Access: | Get fulltext |