Accurate characterization of wafer bond toughness with the double cantilever specimen
The displacement-loaded double cantilever test, also referred to as the "Maszara test" and the "crack opening method" by the wafer bonding community, is a common technique used to evaluate the interface toughness or surface energy of direct wafer bonds. While the specimen is wide...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
2008-01-01.
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Subjects: | |
Online Access: | Get fulltext |