Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

As the surface acoustic wave (SAW) filters incline to ultrafine, the failures resulting from the wafer molding process have become increasingly prominent. A methodology for coupling the mechanisms of die fly and die shift for the SAW filter miniatured with 737 (Formula presented.) × 517 (Formula pre...

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Bibliographic Details
Main Authors: Li, W. (Author), Yu, D. (Author)
Format: Article
Language:English
Published: MDPI 2023
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