Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

In this study, the effect of 0.07 wt.% graphene nanosheets (GNSs) on the thermal, microstructure and intermetallic compounds (IMC) growth kinetics were investigated. Experimental results showed that addition of GNSs to the Sn-3.5Ag solder alloy slightly increased the melting temperature. Scanning el...

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Bibliographic Details
Main Authors: Mayappan, R. (Author), Salleh, A. (Author)
Format: Article
Language:English
Published: Institute of Physics Publishing 2017
Subjects:
Tin
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