Failure prediction of the solder joints in the ball-grid-array package under thermal loading

Failure prediction of the solder joints in the ball-grid-array package under thermal loading

This paper studies the numerical failure mechanism of the solder joints in the ball grid array (BGA) package under thermal reliability process. The package consists of the silicon die, the Flame Retardant 4 (FR-4) substrate and the FR-4 printed circuit board (PCB). A total of 64 95.5Sn-4.0Ag-0.5Cu (...

Full description

Bibliographic Details
Main Authors: Abdullah, A.S (Author), Manap, M.F.A (Author), Yamin, A.F.M (Author), Yusoff, H. (Author)
Format: Article
Language:English
Published: Institute of Physics Publishing 2019
Subjects:
Ball grid array packages
Ball grid arrays
Copper alloys
Crack propagation
Cracks
Failure (mechanical)
Failure prediction
Lead-free solders
Liquidus temperature
Nanostructured materials
Numerical failure
Printed circuit boards
Printed circuit boards (PCB)
Silver alloys
Soldered joints
Soldering
Strain
Temperature cycles
Ternary alloys
Thermal cycling
Thermal fatigue
Thermal load
Thermal loadings
Thermal reliability
Tin alloys
Online Access:View Fulltext in Publisher
View in Scopus

Internet

View Fulltext in Publisher
View in Scopus

Similar Items