Investigation of the Effect of Particle Size and Particle Loading on Thermal Conductivity and Dielectric Strength of Thermoset Polymers
Semiconductor die attach materials for high voltage, high reliability analog devices require high thermal conductivity and retention of dielectric strength. A comparative study of effective thermal conductivity and dielectric strength of selected thermoset/ceramic composites was conducted to determi...
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| Format: | Others |
| Language: | English |
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University of North Texas
2016
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc849629/ |