The Revival of Electrochemistry: Electrochemical Deposition of Metals in Semiconductor Related Research
Adherent Cu films were electrodeposited onto polycrystalline W foils from purged solutions of 0.05 M CuSO4 in H2SO4 supporting electrolyte and 0.025 M CuCO3∙Cu(OH)2 in 0.32 M H3BO3 and corresponding HBF4 supporting electrolyte, both at pH = 1. Films were deposited under constant potential conditio...
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| Format: | Others |
| Language: | English |
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University of North Texas
2005
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc5574/ |