Aluminum and Copper Chemical Vapor Deposition on Fluoropolymer Dielectrics and Subsequent Interfacial Interactions
This study is an investigation of the chemical vapor deposition (CVD) of aluminum and copper on fluoropolymer surfaces and the subsequent interfacial interactions.
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| Format: | Others |
| Language: | English |
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University of North Texas
1997
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc279304/ |