Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints

• Main Author: Wu, Yujing
• Other Authors: Pinizzotto, Russell F.
• Format: Others
• Language: English
• Published: University of North Texas 1994
• Subjects: solder; physics; composites; Solder and soldering.; Eutectic alloys.; Surface mount technology.; Printed circuits > Design and construction.
• Online Access: https://digital.library.unt.edu/ark:/67531/metadc278545/

Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was to investigate the diffusion kinetics and microstructures of six types of composite solder/copper joints.