Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints
Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications...
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| Format: | Others |
| Language: | English |
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University of North Texas
1994
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc278545/ |