Surface and Interfacial Studies of Metal-Organic Chemical Vapor Deposition of Copper

The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promoter substrates during metal-organic chemical vapor deposition (MOCVD) are strongly dependent on the initial Cu precursor-substrate chemistry and surface conditions such as organic contamination and oxid...

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Bibliographic Details
Main Author: Nuesca, Guillermo M.
Other Authors: Kelber, Jeffry Alan, 1952-
Format: Others
Language:English
Published: University of North Texas 1997
Subjects:
Online Access:https://digital.library.unt.edu/ark:/67531/metadc278058/