ACCELERATED AGING OF MWCNT FILLED ELECTRICALLY CONDUCTIVE ADHESIVES

Electrically conductive adhesives (ECA) are discussed and studied with everincreasing interest as an environmentally friendly alternative to solder interconnection in microelectronics circuit packaging. They are used to attach surface mount devices (SMD), Integrated Circuits (IC) and Flip chips in e...

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Bibliographic Details
Main Author: Vangala, Ashwanth Reddy
Format: Others
Published: UKnowledge 2010
Subjects:
Online Access:http://uknowledge.uky.edu/gradschool_theses/630
http://uknowledge.uky.edu/cgi/viewcontent.cgi?article=1634&context=gradschool_theses