Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities
This thesis deals with the electrothermal 3D field and circuit simulation of structures containing thin wires to evaluate their failure probability. Failure probabilities of wires in chip packages from the field of micro- and nanoelectronics are considered as an example. The failure model used in...
| Main Author: | |
|---|---|
| Format: | Others |
| Language: | en |
| Published: |
2019
|
| Online Access: | https://tuprints.ulb.tu-darmstadt.de/8959/1/2019-07-04_Casper_Thorben.pdf Casper, Thorben <http://tuprints.ulb.tu-darmstadt.de/view/person/Casper=3AThorben=3A=3A.html> : Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities. Technische Universität, Darmstadt [Ph.D. Thesis], (2019) |
Internet
https://tuprints.ulb.tu-darmstadt.de/8959/1/2019-07-04_Casper_Thorben.pdfCasper, Thorben <http://tuprints.ulb.tu-darmstadt.de/view/person/Casper=3AThorben=3A=3A.html> : Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities. Technische Universität, Darmstadt [Ph.D. Thesis], (2019)