Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography

Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography

Characterizing hidden solder joint shapes is essential for electronics reliability. Active thermography is a methodology to identify hidden defects inside an object by means of surface abnormal thermal response after applying a heat flux. This research focused on understanding, modeling, and predict...

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Bibliographic Details
Main Author: Giron Palomares, Jose
Other Authors: Hsieh, Sheng-Jen
Format: Others
Language:en_US
Published: 2012
Subjects:
active thermography
hidden solder joint
FEA
multi PCB assemblies
nondestructive evaluation
parametric analysis
artificial neural networks
Online Access:http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-11223

Internet

http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-11223

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