Short-Time Scale Dynamic Failure Modes in a Through-Silicon-Via (TSV) Flip-Chip Configuration
The demand for high performance microelectronic products drives the development of 3-D chip-stacking structure. By the introduction of through-silicon-via (TSV) into 3-D flip-chip packages, microelectronic performance is improved by increasing circuit capacity and diminishing signal delay. However,...
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| Format: | Others |
| Language: | en_US |
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2010
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| Online Access: | http://hdl.handle.net/1969.1/ETD-TAMU-2009-08-7037 |