Modeling defective part level due to static and dynamic defects based upon site observation and excitation balance
Manufacture testing of digital integrated circuits is essential for high quality. However, exhaustive testing is impractical, and only a small subset of all possible test patterns (or test pattern pairs) may be applied. Thus, it is crucial to choose a subset that detects a high percentage of the def...
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Format: | Others |
Language: | en_US |
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Texas A&M University
2004
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Online Access: | http://hdl.handle.net/1969.1/323 |