EMBEDDED SPECKLE BONDLINE DEFECT DETECTION USING ULTRASONIC DIGITAL IMAGE CORRELATION (UT-DIC)
The primary objective of this research is to conduct further evaluation of ultrasonic digital image correlation (UT-DIC) on strain map analysis and defect detection of adhesive joints with embedded speckle pattern. UT-DIC is a non-destructive evaluation method that utilized ultrasonic C-scan images...
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| Format: | Others |
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OpenSIUC
2018
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| Online Access: | https://opensiuc.lib.siu.edu/theses/2391 https://opensiuc.lib.siu.edu/cgi/viewcontent.cgi?article=3405&context=theses |