Finite element analysis of thermal stresses in semiconductor devices
The failure of integrated circuit due to Silicon fracture is one of the problems associated with the production of a semiconductor device. The thermal stresses, which result in die cracking, are for the most part induced during the cooling process after attaching the die with Gold-Silicon solder. Ma...
| Main Author: | |
|---|---|
| Format: | Others |
| Published: |
PDXScholar
1990
|
| Subjects: | |
| Online Access: | https://pdxscholar.library.pdx.edu/open_access_etds/4215 https://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=5225&context=open_access_etds |