Solid State Pre-Formed Electronics Adhesive (SPEA)

Solid State Pre-Formed Electronics Adhesive (SPEA)

In mobile and handheld consumer electronic markets, product use conditions drive the requirement for mechanical strength and device durability. The majority of relatively large form factor electronic components in a laptop, mobile internet device, PDA, or mobile phone use an adhesive as a stiffener...

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Bibliographic Details
Main Author: Cope, Alexander Randon
Format: Others
Published: PDXScholar 2013
Subjects:
Surface mount technology
Electronic packaging > Design and construction
Electronic packaging > Testing
Materials Science and Engineering
Online Access:https://pdxscholar.library.pdx.edu/open_access_etds/1842
https://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=2842&context=open_access_etds

Internet

https://pdxscholar.library.pdx.edu/open_access_etds/1842
https://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=2842&context=open_access_etds

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