Calculation of chip temperatures using ELLPACK
Approved for public release; distribution is unlimited === In this thesis we report on an experiment to solve a three dimensional elliptic problem using ELLPACK software. The physical problem arises when calculating the distribution of temperatures within an electronic package in order to assist in...
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| Language: | en_US |
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Monterey, California. Naval Postgraduate School
2013
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| Online Access: | http://hdl.handle.net/10945/28019 |