Processing and characterization of NiTi Shape Memory Alloy particle reinforced Sn-In solder
of the solder. In this thesis, a new fabrication process for incorporating NiTi particles (10 vol.% NiTi) into Sn-In solder (80Sn-20In) using liquid phase sintering has been developed. The microstructures of the solders were characterized. The behavior of the solder joints during thermomechanical cy...
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Monterey, California. Naval Postgraduate School
2012
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| Online Access: | http://hdl.handle.net/10945/2521 |