Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
Main Author: | Keebler, Henry C.,III. |
---|---|
Other Authors: | NA |
Language: | en_US |
Published: |
Monterey, California. Naval Postgraduate School
2012
|
Online Access: | http://hdl.handle.net/10945/19639 |
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