Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).

Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).

Bibliographic Details
Main Author: Keebler, Henry C.,III.
Other Authors: NA
Language:en_US
Published: Monterey, California. Naval Postgraduate School 2012
Online Access:http://hdl.handle.net/10945/19639

Internet

http://hdl.handle.net/10945/19639

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