Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).

Bibliographic Details
Main Author:	Keebler, Henry C.,III.
Other Authors:	NA
Language:	en_US
Published:	Monterey, California. Naval Postgraduate School 2012
Online Access:	http://hdl.handle.net/10945/19639

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spelling	ndltd-nps.edu-oai-calhoun.nps.edu-10945-196392014-11-27T16:13:20Z Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM). Keebler, Henry C.,III. NA NA NA 2012-11-19T23:57:27Z 2012-11-19T23:57:27Z 1983 Thesis http://hdl.handle.net/10945/19639 ocn640319611 en_US Monterey, California. Naval Postgraduate School
collection	NDLTD
language	en_US
sources	NDLTD
author2	NA
author_facet	NA Keebler, Henry C.,III.
author	Keebler, Henry C.,III.
spellingShingle	Keebler, Henry C.,III. Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
author_sort	Keebler, Henry C.,III.
title	Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
title_short	Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
title_full	Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
title_fullStr	Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
title_full_unstemmed	Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).
title_sort	analysis and testing of the thermal design of the electrical package in the u.s. army's upgraded logic module (ulm).
publisher	Monterey, California. Naval Postgraduate School
publishDate	2012
url	http://hdl.handle.net/10945/19639
work_keys_str_mv	AT keeblerhenryciii analysisandtestingofthethermaldesignoftheelectricalpackageintheusarmysupgradedlogicmoduleulm
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Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM).

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