Modeling of impression testing to obtain mechanical properties of lead-free solders microelectronic interconnects
The increasing structural functionalities of materials in microelectronics and MEMs packages has led to an explosion of interest in characterizing the mechanical properties of small volumes of materials in the micrometer to nanometer regime. In microelectronics packages, one of the main challenges i...
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Monterey, California. Naval Postgraduate School
2012
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| Online Access: | http://hdl.handle.net/10945/1777 |