Processing of NITI reinforced adaptive solder for electronic packaging
Approved for public release; distribution is unlimited === Solder joints provide both electrical and mechanical interconnections between a silicon chip and the packaging substrate in an electronic application. The thermomechanical cycling (TMC) in the solder due to the mismatch of the coefficient of...
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Monterey, California. Naval Postgraduate School
2012
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| Online Access: | http://hdl.handle.net/10945/1681 |