Dynamic response of soldered electronic components under impact loading
The objective of this research was to analyze the effects of impact loading on electronic component failure. A standard fiberglass composite printed circuit board (PCB) card was used in two impact tests. The first test consisted of a PCB card with four adhered strain gauges, which were mounted ins...
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Monterey, California. Naval Postgraduate School
2012
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| Online Access: | http://hdl.handle.net/10945/10714 |