Diffusion, Deformation, and Damage in Lithium-Ion Batteries and Microelectronics
This thesis explores mechanical behavior of microelectronic devices and lithium-ion batteries. We first examine electromigration-induced void formation in solder bumps by constructing a theory that couples electromigration and creep. The theory can predict the critical current density below which...
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| Language: | en_US |
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Harvard University
2014
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| Online Access: | http://dissertations.umi.com/gsas.harvard:11593 http://nrs.harvard.edu/urn-3:HUL.InstRepos:12271804 |