Optimization of three-dimensional branching networks of microchannels for thermal management of microelectronics
The aim of this work is to present a methodology to develop cost-effective thermal management solutions for microelectronic devices, capable of removing maximum amount of heat and delivering maximally uniform temperature distributions. The topological and geometrical characteristics of multiple-stor...
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| Format: | Others |
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FIU Digital Commons
2009
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| Online Access: | http://digitalcommons.fiu.edu/etd/1295 http://digitalcommons.fiu.edu/cgi/viewcontent.cgi?article=2430&context=etd |