Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems

This work presents the development of an in-plane vertical micro-coaxial probe using bulk micromachining technique for high frequency material characterization. The coaxial probe was fabricated in a silicon substrate by standard photolithography and a deep reactive ion etching (DRIE) technique. The...

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Main Author: Boone, Justin
Format: Others
Published: FIU Digital Commons 2013
Subjects:
Online Access:http://digitalcommons.fiu.edu/etd/897
http://digitalcommons.fiu.edu/cgi/viewcontent.cgi?article=2012&context=etd
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spelling ndltd-fiu.edu-oai-digitalcommons.fiu.edu-etd-20122018-01-05T15:28:03Z Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems Boone, Justin This work presents the development of an in-plane vertical micro-coaxial probe using bulk micromachining technique for high frequency material characterization. The coaxial probe was fabricated in a silicon substrate by standard photolithography and a deep reactive ion etching (DRIE) technique. The through-hole structure in the form of a coaxial probe was etched and metalized with a diluted silver paste. A co-planar waveguide configuration was integrated with the design to characterize the probe. The electrical and RF characteristics of the coaxial probe were determined by simulating the probe design in Ansoft’s High Frequency Structure Simulator (HFSS). The reflection coefficient and transducer gain performance of the probe was measured up to 65 GHz using a vector network analyzer (VNA). The probe demonstrated excellent results over a wide frequency band, indicating its ability to integrate with millimeter wave packaging systems as well as characterize unknown materials at high frequencies. The probe was then placed in contact with 3 materials where their unknown permittivities were determined. To accomplish this, the coaxial probe was placed in contact with the material under test and electromagnetic waves were directed to the surface using the VNA, where its reflection coefficient was then determined over a wide frequency band from dc-to -65GHz. Next, the permittivity of each material was deduced from its measured reflection coefficients using a cross ratio invariance coding technique. The permittivity results obtained when measuring the reflection coefficient data were compared to simulated permittivity results and agreed well. These results validate the use of the micro-coaxial probe to characterize the permittivity of unknown materials at high frequencies up to 65GHz. 2013-05-17T07:00:00Z text application/pdf http://digitalcommons.fiu.edu/etd/897 http://digitalcommons.fiu.edu/cgi/viewcontent.cgi?article=2012&context=etd FIU Electronic Theses and Dissertations FIU Digital Commons Micro-Coaxial Probe Through Wafer Coplanar Waveguide Electrical and Computer Engineering
collection NDLTD
format Others
sources NDLTD
topic Micro-Coaxial Probe
Through Wafer
Coplanar Waveguide
Electrical and Computer Engineering
spellingShingle Micro-Coaxial Probe
Through Wafer
Coplanar Waveguide
Electrical and Computer Engineering
Boone, Justin
Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
description This work presents the development of an in-plane vertical micro-coaxial probe using bulk micromachining technique for high frequency material characterization. The coaxial probe was fabricated in a silicon substrate by standard photolithography and a deep reactive ion etching (DRIE) technique. The through-hole structure in the form of a coaxial probe was etched and metalized with a diluted silver paste. A co-planar waveguide configuration was integrated with the design to characterize the probe. The electrical and RF characteristics of the coaxial probe were determined by simulating the probe design in Ansoft’s High Frequency Structure Simulator (HFSS). The reflection coefficient and transducer gain performance of the probe was measured up to 65 GHz using a vector network analyzer (VNA). The probe demonstrated excellent results over a wide frequency band, indicating its ability to integrate with millimeter wave packaging systems as well as characterize unknown materials at high frequencies. The probe was then placed in contact with 3 materials where their unknown permittivities were determined. To accomplish this, the coaxial probe was placed in contact with the material under test and electromagnetic waves were directed to the surface using the VNA, where its reflection coefficient was then determined over a wide frequency band from dc-to -65GHz. Next, the permittivity of each material was deduced from its measured reflection coefficients using a cross ratio invariance coding technique. The permittivity results obtained when measuring the reflection coefficient data were compared to simulated permittivity results and agreed well. These results validate the use of the micro-coaxial probe to characterize the permittivity of unknown materials at high frequencies up to 65GHz.
author Boone, Justin
author_facet Boone, Justin
author_sort Boone, Justin
title Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
title_short Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
title_full Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
title_fullStr Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
title_full_unstemmed Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
title_sort through wafer 3d vertical micro-coaxial probe for high frequency material characterization and millimeter wave packaging systems
publisher FIU Digital Commons
publishDate 2013
url http://digitalcommons.fiu.edu/etd/897
http://digitalcommons.fiu.edu/cgi/viewcontent.cgi?article=2012&context=etd
work_keys_str_mv AT boonejustin throughwafer3dverticalmicrocoaxialprobeforhighfrequencymaterialcharacterizationandmillimeterwavepackagingsystems
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