Through Wafer 3D Vertical Micro-Coaxial Probe for High Frequency Material Characterization and Millimeter Wave Packaging Systems
This work presents the development of an in-plane vertical micro-coaxial probe using bulk micromachining technique for high frequency material characterization. The coaxial probe was fabricated in a silicon substrate by standard photolithography and a deep reactive ion etching (DRIE) technique. The...
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| Format: | Others |
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FIU Digital Commons
2013
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| Online Access: | http://digitalcommons.fiu.edu/etd/897 http://digitalcommons.fiu.edu/cgi/viewcontent.cgi?article=2012&context=etd |