Height inspection of wafer bumps without explicit 3D reconstruction.
by Dong, Mei. === Thesis (M.Phil.)--Chinese University of Hong Kong, 2007. === Includes bibliographical references (leaves 83-90). === Abstracts in English and Chinese. === INTRODUCTION --- p.1 === Chapter 1.1 --- Bump Height Inspection --- p.1 === Chapter 1.2 --- Our Height Inspection System ---...
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| Format: | Others |
| Language: | English Chinese |
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2007
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| Online Access: | http://library.cuhk.edu.hk/record=b5893093 http://repository.lib.cuhk.edu.hk/en/item/cuhk-325847 |