Micrometallurgy in the electroplated bumps for flip-chip applications.
by Shih La Hung Richard. === Thesis submitted in: July 2003. === Thesis (M.Phil.)--Chinese University of Hong Kong, 2004. === Includes bibliographical references (leaves 143-146). === Abstracts in English and Chinese. === Abstract --- p.ii === 論文摘要 --- p.iii === Acknowledgement --- p.iv === Table...
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| Format: | Others |
| Language: | English Chinese |
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2004
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| Online Access: | http://library.cuhk.edu.hk/record=b5892080 http://repository.lib.cuhk.edu.hk/en/item/cuhk-324959 |