Sputtered thin film diffusion barriers for ohmic contact to silicon by platinum electrodes
Microstructure plays a fundamental role in thin film technology, especially regarding the phase stability of a multi-layer ohmic contact stack. Preventing the solid-state reaction between layers is possible if a suitable diffusion barrier material can be inserted between them that is compatible with...
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| Language: | English |
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2019
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| Online Access: | https://doi.org/10.7916/d8-echf-8305 |