Electrodeposition of copper using additive-containing low metal ion concentration electrolytes for EnFACE applications
In the past decade a new electrodeposition process called Electrochemical nano and micro Fabrication by flow and Chemistry (EnFACE) was developed which enabled mask-less pattern transfers onto a metallic substrate. EnFACE uses a novel acid-free, additive-free plating electrolyte containing low conce...
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University of Strathclyde
2017
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.707301 |