The durability of solder joints under thermo-mechanical loading : application to Sn-37Pb and Sn-3.8Ag-0.7Cu lead-free replacement alloy
Solder joints in electronic packages provide mechanical, electrical and thermal connections. Hence, their reliability is also a major concern to the electronic packaging industry. Ball Grid Arrays (BGAs) are a very common type of surface mount technology for electronic packaging. This work primarily...
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Heriot-Watt University
2015
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.691314 |