Methods and structures for characterising integrated circuit interconnect materials and processes
This thesis investigates a number of emerging areas in interconnect metrology with a connection on the use of electrical test structures to extract parameters such as line width, sheet resistance, and the overlay of multiple layers. To address the issue of calibrating optical overlay tools, a novel...
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University of Edinburgh
2007
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.661886 |