A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules

In the Physics-of-Failure based approach to reliability design and assessment, which aims to relate lifetime to the identified root-cause of the potential failures, the development of effective failure mechanism models is a crucial task. The extent and rate of wire bond degradation depends on both t...

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Bibliographic Details
Main Author: Yang, Li
Published: University of Nottingham 2013
Subjects:
Online Access:http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.580196