Mechanisms of thermoplastics to metal adhesion for applications in electronics manufacture
The Substrateless Packaging process was developed at Loughborough University as an alternative method of manufacturing electronics with an improved end-of-life materials recovery profile. The process involves injection moulding to overmould electronic components in thermoplastic polymers. Initial pr...
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Loughborough University
2011
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.551265 |