Diffusion-controlled reactions in gold/lead-tin solder systems
Au/PbSn joints are widely used in the microelectronics industry. Intermetallic formation in Au/60Sn-40wt. %Pb and in Au/62Sn-36Pb-2wt. %Ag systems has been studied in the temperature range 80°C-160°C using diffusion couples. Interdiffusion between Au films and 60Sn-40wt. %Pb solder doped with 2 wt....
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University of Warwick
1989
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| Online Access: | https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.252957 |